Optical interconnects between silicon chips based on light-emitting diodes on nanostructured siliconLeshok, A. A.,
Dolbik, A. V.,
Le Dinh Viа,
Matskevichа, A. I.,
Vysotskii, V. B.,
Shvedov, S. V. -emitting diodes and photodetectors. The
silicon microchannel plate vias are used as light-guiding channels
3D Silicon Photonic Structures Based on Avalanche LED with Interconnections through Optical InterposerLazarouk, S. K.,
Leshok, A. A.,
Kozlova, T. A.,
Dolbik, A. V.,
Le Dinh Vi,
Ilkov, V. K.,
Labunov, V. A. interconnections through
microchannel vias interposers were developed.
Silicon chips placed over each other were
About a contactless transmission of 10 keV electrons through tapering microchannelsAbout a contactless transmission of 10 keV electrons through tapering
microchannels New way for synthesis of porous silicon using ion implantation substrate was provided.
Silicon plates were implanted at energy 30 keV with doses of 7.5 × 1016 - 1.5 × 1017
New way for synthesis of porous silicon using ion implantation substrate was provided.
Silicon plates were implanted at energy 30 keV with doses of 7.5 × 1016 - 1.5 × 1017
Forming Porous Structures on Silicon with a Ferroelectric for Capacitive Microelectronic and Microsystems Engineering ElementsSemenova, O. V.,
Railko, M. Yu.,
Patrusheva, T. N.,
Merkushev, F. F.,
Podorozhyak, S. A.,
Yuzova, V. A.,
Korets, A. Ya.,
Khol’Kin, A. I. The formation of heterostructures based on porous
silicon with barium titanate for application
Лавинные светодиоды на основе наноструктурированного кремния для оптических межсоединенийЛе Динь Ви,
Лешок, А. А.,
Долбик, А. В.,
Перко, С. Л.,
Лазарук, С. К.,
Le Dinh Vi,
Leshok, A. A.,
Dolbik, A. V.,
Perko, S. L.,
Lazarouk, S. K. and a
microchannel silicon wafer used to transmit a light signal. The study of various operating modes