Improved microstructure, mechanical properties and electrical conductivity of the Cu–Ni–Sn–Ti–Cr alloy due to Ce micro-addition
Tang, Shunlong,
Zhou, Meng,
Zhang, Yi,
Xu, Deye,
Zhang, Zhiyang,
Zheng, Xianhua,
Li, De,
Li, Xu,
Tian, Baohong,
Jia, Yanlin,
Liu, Yong,
Volinsky, Alex A.,
Marchenko, Ekaterina S.
Связанные документы (рекомендация CORE)