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The comparative analysis of technological regimes for improving the electrical insulation strength of double-sided alumina bases with vias-sided alumina bases for potential use in power multichip modules. Preliminary experimental studies of fabricated

Mechanical impulse enhancement in a microsystem based on nanoporous silicon combustionmultichip structure

Effect of anodic voltage on parameters of porous alumina formed in sulfuric acid electrolytesmultichip structure

The electrical insulation strength of anodic Al2O3 coatings with vias for power multichip modules in vias of double-sided alumina bases for potential use in power multichip modules were discussed

Моделирование проволочного монтажа в многокристальных модуляхModelling wire bonding in multichip mod

Многокристальный квантовый вычислительный модульMultichip quantum computing cluster

Особенности роста пористого оксида алюминия of interconnection and aluminium packages of microelectronic multichip modules manufacturing are presented.

Assembly and Mounting of Electronic Devices: Advancements in Technology and Equipment, and the assembly of multichip electronic modules.

Assembly and Mounting of Electronic Devices: Advancements in Technology and Equipment, and the assembly of multichip electronic modules.

Thermal and Electromagnetic Properties of Polymer Holey Structures Produced by Additive ManufacturingMultifunctional 3D-printed holey structures made of composite polymers loaded with nanocarbon were

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