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Eu2O3-HI-H2O and EuI3-HI-H2O Systems at 25°C
Emel'yanov V.I., Kuznetsova L.I., Abramova L.V., Ezhov A.I.
Eu2O3-HI-H2O and EuI3-HI-H2O systems at 25 degrees C
Emel'yanov V.I., Kuznetsova L.I., Abramova L.K., Ezhov A.I.
Synthesis and Some Properties of Lanthanide Bromotungstates
Venskovskii N.U., Tararov A.V., Dudareva A.G., Emel'yanov V.I., Popova I.S.
Holmium Iodide Hydrates: Synthesis and Properties
Danilenko T.V., Emel'yanov V.I., Venskovskii N.U., Ezhov A.I.
Physicochemical Foundations of Electric Mounting Soldering
Lanin, V. L., Emel’yanov, V. A., Petukhov, I. B.
. The formation of a soldered joint with a specific structure results from the physicochemical interaction between
Solderability of Materials and Electronic Components
Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.
criteria for its assessment. A comprehensive categorization of solderable materials into three distinct
Assembly and Mounting of Electronic Devices: Advancements in Technology and Equipment
Lanin, V. L., Emel’yanov, V. A., Petukhov, I. B.
of electronic devices, emerges as pivotal for producing viable products. We provide a comprehensive
Assembly and Mounting of Electronic Devices: Advancements in Technology and Equipment
Lanin, V. L., Emel’yanov, V. A., Petukhov, I. B.
of electronic devices, emerges as pivotal for producing viable products. We provide a comprehensive
Materials for Building Electrical Connections
Lanin, V. L., Emel’yanov, V. A., Petukhov, I. B.
materials. A promising avenue of exploration lies in the utilization of water-based fluxes and flux gels
Assembly and Mounting of Electronic Modules on Printed Circuit Boards
Lanin, V. L., Emel’yanov, V. A., Petukhov, I. B.
the solderability of printed circuit boards, immersion coatings have become widely adopted, achieved through a

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