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Physicochemical Foundations of Electric Mounting Soldering preparation
of the materials being joined, activate both the materials and solder, eliminate oxide films
The influence of silver content on structure and properties of Sn-Bi-Ag solder and Cu/solder/Cu joints and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared
New types of lead-free solders and their propertiesThe aim of this work is an experimental study of lead-free solders. Ternary and binary alloys
Assembly and Mounting of Electronic Modules on Printed Circuit Boards
components. The preparation of electronic components for assembly entails several essential operations
Solderability assessment of galvanic coatings in electronicsThe problem of providing high-quality soldered joints during the assembly and installation
Solderability of Materials and Electronic ComponentsThe concept of solderability is rigorously defined, accompanied by the proposal of quantitative
Ultrasonic soldering in electronicsUltrasonic (US) soldering of electronic components, as an alternative to flux soldering
Ultrasonic Soldering in Electronics: New OpportunitiesInterest to processes flux-free ultrasonic soldering and tinning details and conclusions
High-Frequency Heating for Soldering in ElectronicsProcesses of high-frequency (HF) heating are considered and its parameters for the soldering
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