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Modeling local induction heating of solder balls for flip-chip mounting in COMSOL MultiphysicsFor Flip-chip mounting, it is necessary to form contact bumps for 2.5D and 3D electronic modules

The comparative analysis of technological regimes for improving the electrical insulation strength of double-sided alumina bases with vias-sided alumina bases for potential use in power multichip modules. Preliminary experimental studies of fabricated

Astatic Gyrocompass Based on a Hybrid Micromechanical Gyroscope characteristics and a lower level of power consumption. The device uses a modulation principle based on taking

Information technologies for creating spatiotemporal modems multiposition active-passive radar systems of observation by selecting the type of intrapulse modulation of partial signals

Assessing the efficiency of robot communication. That index is calculated by means of a fuzzy deduction module

Пайка SMD компонентов диодным лазером.In electronic modules with superficial installation raise of density of assembly joints causes application

Approaches to the optimization of the electronic module using the research of transformation of energy of mechanical exposureThe influence of destabilizing factors affecting the design of the electronic module is considered

Digital twin for pv plant’s power generation analysis for array, but defective modules with some electrical issues in particular array could be identified only

A subsystem of the “IntonTrainer” for learning and training Belarussian intonationThe article presents Belarusian module of program complex "IntonTrainer" for training learners

Мобильный сканер RFID-меток на базе модуля EM-18 on an ESP8266 microcontroller and an EM18 RFID module has been developed.

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