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Моделирование тепловых полей при формировании шариков припоя индукционного нагреваSimulation of thermal fields during the formation of solder balls of induction heating

Effect of Heating Temperature and Modification of Al-27% Cu-6% Si Melt on the Structure and Phase Composition of Crystallized SpecimensThe effect of liquid-phase treatment of Al - 27 wt.% Cu - 6 wt.% Si melt used for making A34 solder

Сборка 3D электронных модулей с использованием шариковых выводов припоя и лазерного излучения pads of crystals and substrates using solder balls. Formation of conclusions for Flip Chip technology

Method for obtaining ingots of the A34 solder based on an investigation into the relation between the structure and properties of liquid and solid metals composition of the ingots of the A34 solder is performed. Modification is performed by force of heating

Оптимизация режимов монтажа кристаллов интегральных схем с применением ультразвуковых колебаний-60%. Experimental studies of soldering processes with ultrasonic vibrations have been carried out with changes

Применение термовоздушных станций при монтаже и демонтаже электронных компонентов конвекционного нагрева. Characteristics thermoair soldering stations applied to superficial mounting

Моделирование лазерного нагрева шариков припоя при сборке 3D электронных модулейLaser heating is a promising method for forming solder balls during the assembly of 3D electronic

The research of inductive heating process in the magnetic core gap local heating. These devices are effective for electronics soldering. The optimal inductors construction

The application of the concentrated electromagnetic energy streams in electronics manufacturing (HF) energy are claimed in electronics manufacturing. US soldering is nonpolluting and more economic

Устройство системы регулирования и поддержания температуры жала паяльникаThe device and the principle of operation of the soldering iron temperature control system

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